- Patent Title: Semiconductor memory device and method for manufacturing the same
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Application No.: US15064735Application Date: 2016-03-09
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Publication No.: US09685321B2Publication Date: 2017-06-20
- Inventor: Masaya Terai , Shigeki Hattori , Hideyuki Nishizawa , Koji Asakawa
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-060238 20150324
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/02 ; H01L21/28 ; G11C11/56 ; H01L51/05 ; H01L27/11582 ; H01L51/00

Abstract:
A semiconductor memory device in an embodiment includes a semiconductor layer, a control gate electrode, an organic molecular layer provided between the semiconductor layer and the control gate electrode, and a first insulating layer provided between the organic molecular layer and the semiconductor layer, the first insulating layer having a first layer containing alkyl chains and a second layer containing siloxane, the second layer being provided between the first layer and the organic molecular layer.
Public/Granted literature
- US20160284868A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-09-29
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