Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US14988636Application Date: 2016-01-05
-
Publication No.: US09685503B2Publication Date: 2017-06-20
- Inventor: Masatoshi Aketa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-084715 20110406; JP2011-143179 20110628
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/06 ; H01L29/66 ; H01L29/872 ; H01L29/10 ; H01L29/20 ; H01L29/47

Abstract:
A semiconductor device includes a first conductivity type semiconductor layer that includes a wide bandgap semiconductor and a surface. A trench, including a side wall and a bottom wall, is formed in the semiconductor layer surface, and a Schottky electrode is connected to the surface. Opposite edge portions of the bottom wall of the trench each include a radius of curvature, R, satisfying the expression 0.01 L
Public/Granted literature
- US20160181356A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-06-23
Information query
IPC分类: