Invention Grant
- Patent Title: Upper plate biasing unit and electrical component socket
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Application No.: US14913838Application Date: 2014-08-25
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Publication No.: US09685722B2Publication Date: 2017-06-20
- Inventor: Yuki Ueyama
- Applicant: ENPLAS CORPORATION
- Applicant Address: JP Saitama
- Assignee: ENPLAS CORPORATION
- Current Assignee: ENPLAS CORPORATION
- Current Assignee Address: JP Saitama
- Agency: Staas & Halsey LLP
- Priority: JP2013-177647 20130829
- International Application: PCT/JP2014/072093 WO 20140825
- International Announcement: WO2015/029920 WO 20150305
- Main IPC: H01R12/73
- IPC: H01R12/73 ; H01R12/91 ; H05K7/10 ; H05K1/18 ; H01R12/70

Abstract:
The present invention includes a lower plate, an upper plate provided above the lower plate in such a manner that the upper plate is biased so as to be vertically movable, a guide member attached to the upper plate, the guide member guiding vertical movement of the upper plate, and a spring provided below the guide member, the spring biasing the upper plate upward via the guide member. In the lower plate, an insertion hole having a size that allows the spring and the guide member to pass therethrough in a vertical direction is formed. In the insertion hole, a spring holding member that holds the spring is detachably provided. Such configuration enables suppression of warpage of the upper plate caused by a biasing force of the spring and enables work for replacement of the upper plate to be performed easily and quickly.
Public/Granted literature
- US20160365657A1 UPPER PLATE BIASING UNIT AND ELECTRICAL COMPONENT SOCKET Public/Granted day:2016-12-15
Information query
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