Invention Grant
- Patent Title: Wiring board, manufacturing method for wiring board, and image pickup apparatus
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Application No.: US14017849Application Date: 2013-09-04
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Publication No.: US09693460B2Publication Date: 2017-06-27
- Inventor: Noriyuki Fujimori
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2011-048083 20110304
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; A61B1/05 ; H04N5/225 ; H05K3/40 ; H05K3/10 ; A61B1/00 ; H05K3/00 ; H05K3/46
Abstract:
A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.
Public/Granted literature
- US20140003018A1 WIRING BOARD, MANUFACTURING METHOD FOR WIRING BOARD, AND IMAGE PICKUP APPARATUS Public/Granted day:2014-01-02
Information query
