Invention Grant
- Patent Title: Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
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Application No.: US15207016Application Date: 2016-07-11
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Publication No.: US09694337B2Publication Date: 2017-07-04
- Inventor: Dylan J. Boday , Joseph Kuczynski , Robert E. Meyer, III
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Matthew J. Bussan
- Main IPC: B01J13/18
- IPC: B01J13/18 ; B32B43/00 ; H01F1/00 ; B32B9/04 ; C09K5/08

Abstract:
An enhanced thermal interface material (TIM) gap filler for filling a gap between two substrates (e.g., between a coldplate and an electronics module) includes microcapsules adapted to rupture in a magnetic field. The microcapsules, which are distributed in a TIM gap filler, each have a shell that encapsulates a solvent. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. In one embodiment, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles are incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. To enable easy removal of one substrate affixed to another substrate by the enhanced TIM gap filler, the substrates are positioned within a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the solvent, which dissolves and/or swells the TIM gap filler, thereby reducing the bond strength between the substrates.
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