Invention Grant
- Patent Title: Method of joining cooling component
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Application No.: US15196632Application Date: 2016-06-29
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Publication No.: US09694433B2Publication Date: 2017-07-04
- Inventor: Tsuyoshi So , Hideo Kubo , Yoshinori Uzuka , Nobumitsu Aoki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2015-141793 20150716
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K31/02 ; B23K1/00 ; B23K35/02 ; B23K35/30 ; H05K1/02 ; H01L23/473 ; B23K101/40
Abstract:
A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.
Public/Granted literature
- US20170014929A1 METHOD OF JOINING COOLING COMPONENT Public/Granted day:2017-01-19
Information query
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