An imprint apparatus of the present invention molds an uncured resin on a substrate using a mold and cures the resin to thereby form a pattern of the cured resin on the substrate. The imprint apparatus includes a gas supply mechanism configured to supply gas from the mold side toward the substrate and to recover the supplied gas at the mold side, when the mold is pressed against the uncured resin; a substrate holding unit configured to be movable while holding the substrate and have a flat plate portion that has a surface height which is adjusted to the level of the surface of the held substrate and is disposed on the outside of the substrate so as to surround the substrate; and a gas recovery mechanism configured to recover the gas entrapped in a gap region which is present between the outer circumferential side of the substrate held by the substrate holding unit and the inner circumferential side of the flat plate portion toward the substrate.