Invention Grant
- Patent Title: System and method for embossing the wire side of a molded fiber article
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Application No.: US14546835Application Date: 2014-11-18
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Publication No.: US09694536B2Publication Date: 2017-07-04
- Inventor: Keegan Y. Yang , Donald V. Breton , James Michaud
- Applicant: Huhtamaki, Inc.
- Applicant Address: US KS De Soto
- Assignee: HUHTAMAKI, INC.
- Current Assignee: HUHTAMAKI, INC.
- Current Assignee Address: US KS De Soto
- Agency: Husch Blackwell LLP
- Main IPC: B29C59/02
- IPC: B29C59/02 ; D21J7/00 ; B65D1/34 ; B29L31/00 ; B29C33/42 ; B65D85/30 ; B29C33/10

Abstract:
A system and method for constructing a molded fiber article capable of having detailed indicia embossed thereon is provided. A molded fiber article having a smooth surface with detailed indicia is also provided. The system includes using a wire mesh structure coupled with an embossing plate such that the embossing plate imparts a smooth surface with indicia onto the molded fiber article during formation. The smooth surface if the embossing plate allows for greater detail than that of the textured surface created by the wire mesh structure. The system may also include a forming die that generally conforms to the wire mesh structure to facilitate formation of the molded fiber article. The wire mesh structure may include a recessed area for housing the embossing plate, which may be attached to the wire mesh structure using fasteners and a backing plate.
Public/Granted literature
- US20150140288A1 System and Method for Embossing the Wire Side of a Molded Fiber Article Public/Granted day:2015-05-21
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