Invention Grant
- Patent Title: Additive manufacturing apparatus with assembled and disassembled feature
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Application No.: US14381676Application Date: 2014-02-27
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Publication No.: US09694543B2Publication Date: 2017-07-04
- Inventor: Gen Li , Yang Shen , Zhihong Li , Wenjuan Chen
- Applicant: SHENZHEN WEISTEK TECHNOLOGY CO., LTD
- Applicant Address: CN
- Assignee: Shenzhen Weistek Technology Co., Ltd.
- Current Assignee: Shenzhen Weistek Technology Co., Ltd.
- Current Assignee Address: CN
- Agency: Tolpin & Partners, PC
- Agent Thomas W. Tolpin
- Priority: CN201320503585U 20130816
- International Application: PCT/CN2014/072643 WO 20140227
- International Announcement: WO2015/021770 WO 20150219
- Main IPC: B29C67/00
- IPC: B29C67/00 ; B33Y30/00 ; B33Y50/02

Abstract:
An additive manufacturing apparatus with assembled and dissembled feature includes a base having a cavity, a control circuit is installed in the cavity. An upper surface of the base defines a through hole for an electrical socket extending through the base and being exposed on the upper surface. A stand connecting member is provided on the upper surface. A material deposition device for depositing material is provided with a beam connecting member. A movable platform capable of moving along a Y axis direction for carrying the deposited material is provided with a column connecting member. A stand having a column, a beam is provided on a top of the column. The beam is provided with a material, deposition device connecting member. The column is provided with a movable platform connecting member. A bottom of the column is provided with at least one base connecting member corresponding to the base.
Public/Granted literature
- US20160263831A1 Additive Manufacturing Apparatus With Assembled And Disassembled Feature Public/Granted day:2016-09-15
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