Invention Grant
- Patent Title: Modular mounting structure with embedded electrical bus
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Application No.: US14333621Application Date: 2014-07-17
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Publication No.: US09694909B2Publication Date: 2017-07-04
- Inventor: Richard C. Uskert , Paul Nesline
- Applicant: AAI Corporation
- Applicant Address: US MD Hunt Valley
- Assignee: AAI Corporation
- Current Assignee: AAI Corporation
- Current Assignee Address: US MD Hunt Valley
- Agency: BainwoodHuang
- Main IPC: B64C1/22
- IPC: B64C1/22 ; B64D7/00 ; B64D9/00 ; B64D47/08
Abstract:
A modular mounting structure is described which allows for the easy installation and removal of various payloads from a vehicle structure. An embedded electrical bus feature further supports the installation of the various payloads into the vehicle structure.
Public/Granted literature
- US20160016666A1 Modular Mounting Structure with Embedded Electrical Bus Public/Granted day:2016-01-21
Information query
