The invention aims to improve temperature resistance for a curable composition based on a silyl-terminated polymer. This is achieved by using a combination of at least two phenolic compounds, of which one is free of thioether groups, while the other contains at least one thioether group in at least one alkyl side chain. The invention further relates to the use of the curable composition as an adhesive, sealant and/or coating substance and to the use of the combination of phenolic compounds to increase the temperature stability in curable compositions.