Invention Grant
- Patent Title: High power impulse magnetron sputtering process to achieve a high density high SP3 containing layer
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Application No.: US14820152Application Date: 2015-08-06
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Publication No.: US09695503B2Publication Date: 2017-07-04
- Inventor: Michael W. Stowell , Yongmei Chen
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C14/35 ; H01L21/02 ; C23C14/06 ; C23C16/27 ; C23C16/50

Abstract:
Methods for depositing a nanocrystalline diamond layer are disclosed herein. The method can include delivering a sputter gas to a substrate positioned in a processing region of a first process chamber, the first process chamber having a carbon-containing sputter target, delivering an energy pulse to the sputter gas to create a sputtering plasma, the sputtering plasma having a sputtering duration, the energy pulse having an average power between 1 W/cm2 and 10 W/cm2 and a pulse width which is less than 100 μs and greater than 30 μs, the sputtering plasma being controlled by a magnetic field, the magnetic field being less than 300. Gauss, and delivering the sputtering plasma to the sputter target to form an ionized species, the ionized species forming a crystalline carbon-containing layer on the substrate.
Public/Granted literature
- US20160053366A1 HIGH POWER IMPULSE MAGNETRON SPUTTERING PROCESS TO ACHIEVE A HIGH DENSITY HIGH SP3 CONTAINING LAYER Public/Granted day:2016-02-25
Information query
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