Invention Grant
- Patent Title: Nozzle and nozzle assembly configured to minimize combined thermal and pressure stress during transients
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Application No.: US13169490Application Date: 2011-06-27
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Publication No.: US09695934B2Publication Date: 2017-07-04
- Inventor: Wesley P. Bauver, II , Donald W. Bairley , Ian J. Perrin , Glenn T. Selby , Rahul J. Terdalkar
- Applicant: Wesley P. Bauver, II , Donald W. Bairley , Ian J. Perrin , Glenn T. Selby , Rahul J. Terdalkar
- Applicant Address: CH Baden
- Assignee: GENERAL ELECTRIC TECHNOLOGY GMBH
- Current Assignee: GENERAL ELECTRIC TECHNOLOGY GMBH
- Current Assignee Address: CH Baden
- Agency: GE Global Patent Operation
- Agent Stephen G. Midgley
- Main IPC: A62C31/02
- IPC: A62C31/02 ; F16J12/00
Abstract:
In a nozzle and a nozzle assembly, for use in a pressure vessel, stress analysis is used to determine areas of stress concentration. The nozzle is configured to reduce these stress concentrations.
Public/Granted literature
- US20120325940A1 NOZZLE AND NOZZLE ASSEMBLY CONFIGURED TO MINIMIZE COMBINED THERMAL AND PRESSURE STRESS DURING TRANSIENTS Public/Granted day:2012-12-27
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