For a headlight comprising a plurality of light-emitting diode arrangements (LG) arranged in a manner distributed in planar fashion on a carrier plate (TP), a cooling device for dissipating thermal power losses arising in the individual light-emitting diode arrangements, in which cooling device a plurality of flow channels extending parallel in terms of flow engineering are provided. The individual flow channels each contain a heat sink (KK), around which flows the partial air flow through the flow channel (FR) for the transfer of heat and which is connected to the relevant assigned light-emitting diode arrangement in a manner exhibiting good thermal conductivity.