Invention Grant
- Patent Title: Cooling apparatus, heat receiving section and boiling section used therein, and method of manufacturing the same
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Application No.: US14427487Application Date: 2013-07-19
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Publication No.: US09696068B2Publication Date: 2017-07-04
- Inventor: Arihiro Matsunaga , Minoru Yoshikawa , Hitoshi Sakamoto , Akira Shoujiguchi , Masaki Chiba , Kenichi Inaba
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wilmer Cutler Pickering Hale and Dorr LLP
- Priority: JP2012-205801 20120919
- International Application: PCT/JP2013/070262 WO 20130719
- International Announcement: WO2014/045714 WO 20140327
- Main IPC: F25B39/02
- IPC: F25B39/02 ; H01L23/427 ; B23P15/26

Abstract:
In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.
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