Invention Grant
- Patent Title: Loop heat pipe and electronic equipment using the same
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Application No.: US13870569Application Date: 2013-04-25
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Publication No.: US09696096B2Publication Date: 2017-07-04
- Inventor: Hiroki Uchida , Susumu Ogata , Seiji Hibino
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28D15/04 ; H01L23/427 ; F28D21/00

Abstract:
A loop heat pipe includes an evaporator to cause a liquid-phase working fluid to be vaporized by heat from a heat source; a condenser to condense the vaporized working fluid; a circulation path including a liquid line and a vapor line to connect the condenser and the evaporator in a loop; a tank provided on the liquid line and configured to accommodate the liquid-phase working fluid; a connecting line to connect the tank and the evaporator to supply the liquid-phase working fluid to the evaporator; and a bypass line positioned over the connecting line in a direction of gravity and connecting the evaporator and the tank, the bypass line being configured to discharge a vapor bubble produced in the evaporator during operation of the loop heat pipe to the tank.
Public/Granted literature
- US20130233521A1 LOOP HEAT PIPE AND ELECTRONIC EQUIPMENT USING THE SAME Public/Granted day:2013-09-12
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