A light weight pre-stressed antiballistic article including a monolith ceramic plate/tile bonded to a thin lightweight thermal expansion material with an adhesive, characterized, in that the thermal expansion material has a thermal expansion coefficient at least 50% higher than the ceramic plate/tile, and the thermal expansion material is bonded to either the front face, back face or both faces of the ceramic plate/tile at a bonding temperature of between 50° C. and 250° C. with adhesive and subsequently cooled, whereby upon cooling, the bonded thermal expansion material contracts to a greater extent than the ceramic plate/tile, exerting compression stress on the ceramic plate/tile.