- Patent Title: Microchip and film forming method for metal thin film of microchip
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Application No.: US14895405Application Date: 2014-06-02
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Publication No.: US09696253B2Publication Date: 2017-07-04
- Inventor: Kinichi Morita , Toshikazu Kawaguchi
- Applicant: USHIO DENKI KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: USHIO DENKI KABUSHIKI KAISHA
- Current Assignee: USHIO DENKI KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2013-117836 20130604
- International Application: PCT/JP2014/002911 WO 20140602
- International Announcement: WO2014/196185 WO 20141211
- Main IPC: B01L3/00
- IPC: B01L3/00 ; H01L21/00 ; G01N21/05 ; C01G23/053 ; C03C17/36
Abstract:
Disclosed herein are a microchip provided with a titanium oxide film between a glass substrate and a metal thin film; and a method for forming the metal thin film and the titanium oxide film on the glass substrate of the microchip. The microchip has a second microchip substrate that has the metal thin film inside a channel, and the titanium oxide film, which has a low extinction coefficient, is provided as a buffer layer between the substrate and the metal thin film such as a gold film.
Public/Granted literature
- US20160109356A1 MICROCHIP AND FILM FORMING METHOD FOR METAL THIN FILM OF MICROCHIP Public/Granted day:2016-04-21
Information query
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