Invention Grant
- Patent Title: Interdigitated optical modulator
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Application No.: US14605744Application Date: 2015-01-26
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Publication No.: US09696567B2Publication Date: 2017-07-04
- Inventor: Dawei Zheng , Hongbing Lei , Qianfan Xu , Xiao Shen , Yusheng Bai
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: Futurewei Technologies, Inc.
- Current Assignee: Futurewei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Agency: Conley Rose, P.C.
- Main IPC: G02F1/025
- IPC: G02F1/025 ; H04B10/54 ; B82Y20/00 ; G02F1/015

Abstract:
An optical modulator comprises a silicon substrate, a buried oxide (BOX) layer disposed on top of the silicon substrate, and a ridge waveguide disposed on top of the BOX layer and comprising a first n-type silicon (n-Si) slab, a first gate oxide layer coupled to the first n-Si slab, a first p-type silicon (p-Si) slab coupled to the first gate oxide layer, and a light propagation path that travels sequentially through the first n-Si slab, the first gate oxide layer, and the first p-Si slab.
Public/Granted literature
- US20150212346A1 Interdigitated Optical Modulator Public/Granted day:2015-07-30
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