Invention Grant
- Patent Title: Apparatus and method of segmenting sensor data output from a semiconductor manufacturing facility
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Application No.: US14279629Application Date: 2014-05-16
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Publication No.: US09696717B2Publication Date: 2017-07-04
- Inventor: Hae-Sang Park , Young-Hak Lee , Jung-Hee Kim , Heui-Sik Jeon , Eunjeong Lucy Park , Sungzoon Cho , Jooseoung Park , Jiwon Yang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do KR Seoul
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,SEOUL NATIONAL UNIVERSITY R & DB FOUNDATION
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,SEOUL NATIONAL UNIVERSITY R & DB FOUNDATION
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do KR Seoul
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2013-0092617 20130805
- Main IPC: G05B15/02
- IPC: G05B15/02 ; G05B19/418 ; G05B23/02

Abstract:
An apparatus and method of segmenting sensor data are provided. The apparatus includes a sensor, a first segmentation unit, a continuity evaluation unit, a second segmentation unit, and a segmentation determination unit. The sensor collects sensor data for a process of the semiconductor manufacturing facility. The first segmentation unit extracts a variation point of the sensor data to perform an abnormal difference (AD) segmentation on the sensor data based on the at least one variation point. The continuity evaluation unit evaluates a continuity ratio of the sensor data. The second segmentation unit performs a free-knot spline (FS) segmentation on the sensor data when the continuity ratio exceeds a reference ratio. The segmentation determination unit compares the AD segmentation result with the FS segmentation result and to select one of the results on the comparison result.
Public/Granted literature
- US20150039117A1 APPARATUS AND METHOD OF SEGMENTING SENSOR DATA OUTPUT FROM A SEMICONDUCTOR MANUFACTURING FACILITY Public/Granted day:2015-02-05
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