Bits per inch (BPI) is increased, and faster risetime is achieved while adjacent track erasure (ATE) is maintained at an acceptable level by inserting a 10-12 kG magnetic (TS0) layer between a 19-24 kG hot seed layer and 16-19 kG magnetic layer in a trailing shield structure at the ABS. A back portion (TY0) of the 10-12 kG magnetic layer is formed in a back gap connection between a back portion of the 16-19 kG magnetic layer and a trailing side of the main pole layer. A front side of the TY0 layer is 1-2 microns from the ABS and thereby improves BPI and writer speed. Accordingly, throat height in the write head may be reduced to less than 500 nm and thereby enables better bit error rate (BER). The TS0 layer is responsible for maintaining clean ATE near a far side of the writer track.