Invention Grant
- Patent Title: PTC device
-
Application No.: US15212911Application Date: 2016-07-18
-
Publication No.: US09697933B2Publication Date: 2017-07-04
- Inventor: Hiroyuki Koyama
- Applicant: LITTELFUSE JAPAN G.K.
- Applicant Address: JP Kanagawa
- Assignee: Littelfuse Japan G.K.
- Current Assignee: Littelfuse Japan G.K.
- Current Assignee Address: JP Kanagawa
- Priority: JP2011-103107 20110502; JP2011-197370 20110909
- Main IPC: H02H3/08
- IPC: H02H3/08 ; H02H3/087 ; H01C7/02 ; H01C1/14 ; H01C17/28

Abstract:
The present invention relates to a new PTC device having a configuration with which protrusion of solder paste and/or an excess portion of epoxy resin do not adversely affect a jig. Such PTC device 30 comprises a PTC member 32 and leads 34 and 36 electrically connected to both sides of the PTC member the PTC member comprises a PTC element 38 and metal electrodes 40 and 42 placed on both sides of the PTC element respectively, each lead is electrically connected to the metal electrode respectively via an electrically conductive connection portion 50, and at least one 36 of the leads has a concave portion which is defined with a bottom portion 44 located adjacently to the metal electrode of the PTC member and a wall portion 46 surrounding the electrically conductive connection portion which connects the leads to the metal electrode.
Public/Granted literature
- US20160329136A1 PTC DEVICE Public/Granted day:2016-11-10
Information query