Invention Grant
- Patent Title: Substrate treatment method and substrate treatment apparatus
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Application No.: US14667769Application Date: 2015-03-25
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Publication No.: US09698031B2Publication Date: 2017-07-04
- Inventor: Kenji Kobayashi , Manabu Okutani
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2014-062400 20140325
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; H01L21/67 ; C23C16/46 ; C23C16/458 ; C23C16/52 ; H01L21/02 ; H01L21/306 ; H01L21/324 ; H01L21/673 ; H01L21/687
Abstract:
A substrate treatment method is provided, which includes: an organic solvent replacing step of supplying an organic solvent, whereby a liquid film of the organic solvent is formed on the substrate as covering the upper surface of the substrate to replace a rinse liquid with the organic solvent; a substrate temperature increasing step of allowing the temperature of the upper surface of the substrate to reach a first temperature level higher than the boiling point of the organic solvent after the formation of the organic solvent liquid film, whereby a vapor film of the organic solvent is formed below the entire organic solvent liquid film between the organic solvent liquid film and the substrate to levitate the organic solvent liquid film above the organic solvent vapor film; and an organic solvent removing step of removing the levitated organic solvent liquid film from above the upper surface of the substrate.
Public/Granted literature
- US20150279708A1 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS Public/Granted day:2015-10-01
Information query
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