Invention Grant
- Patent Title: Germanium FinFETs with metal gates and stressors
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Application No.: US15005424Application Date: 2016-01-25
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Publication No.: US09698060B2Publication Date: 2017-07-04
- Inventor: Chih Chieh Yeh , Chih-Sheng Chang , Clement Hsingjen Wann
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/78 ; H01L29/06 ; H01L21/8256 ; H01L21/8238 ; H01L29/66 ; H01L21/02 ; H01L21/762 ; H01L29/08

Abstract:
An integrated circuit structure includes an n-type fin field effect transistor (FinFET) and a p-type FinFET. The n-type FinFET includes a first germanium fin over a substrate; a first gate dielectric on a top surface and sidewalls of the first germanium fin; and a first gate electrode on the first gate dielectric. The p-type FinFET includes a second germanium fin over the substrate; a second gate dielectric on a top surface and sidewalls of the second germanium fin; and a second gate electrode on the second gate dielectric. The first gate electrode and the second gate electrode are formed of a same material having a work function close to an intrinsic energy level of germanium.
Public/Granted literature
- US20160155668A1 Germanium FinFETs with Metal Gates and Stressors Public/Granted day:2016-06-02
Information query
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