Invention Grant
- Patent Title: Integration of backside heat spreader for thermal management
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Application No.: US15210970Application Date: 2016-07-15
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Publication No.: US09698075B2Publication Date: 2017-07-04
- Inventor: Archana Venugopal , Marie Denison , Luigi Colombo , Hiep Nguyen , Darvin Edwards
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/00 ; H01L21/48 ; H01L23/367
Abstract:
A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.
Public/Granted literature
- US20160322277A1 INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT Public/Granted day:2016-11-03
Information query
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