Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m° C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds. The heat conductive silicone composition provides a cured object having a storage modulus, loss modulus, and coefficient of loss within appropriate ranges; peeling and pump out during heating/cooling cycle tending not to occur, and increases in thermal resistance being suppressed.