Invention Grant
- Patent Title: Leadframe strip assembly and method of processing
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Application No.: US14978425Application Date: 2015-12-22
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Publication No.: US09698085B1Publication Date: 2017-07-04
- Inventor: Rex Araneta Cari-an , Ruby Ann Merto Camenforte , Roxanna Bauzon Samson , Glenn Juan Morado
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/00

Abstract:
A method of processing a leadframe strip having opposite first and second longitudinal ends and a plurality of leadframe panels positioned between the first and second longitudinal ends, each of the leadframe panels including an array of leadframe portions. The method includes saw cutting the leadframe rails and panels with a plurality of laterally extending saw cuts that each extend through the first and second rails and a panel connector portion of the leadframe strip positioned between adjacent panels of the leadframe strip. A method of reducing blade heating during leadframe strip singulation is described. Leadframe strip assemblies are also described.
Public/Granted literature
- US20170179008A1 LEADFRAME STRIP ASSEMBLY AND METHOD OF PROCESSING Public/Granted day:2017-06-22
Information query
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