Invention Grant
- Patent Title: Embedded circuit package
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Application No.: US15055669Application Date: 2016-02-29
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Publication No.: US09698124B2Publication Date: 2017-07-04
- Inventor: Piers Tremlett , Richard Birch
- Applicant: Microsemi Semiconductor Limited
- Applicant Address: GB Caldicot, Monmouthsh
- Assignee: Microsemi Semiconductor Limited
- Current Assignee: Microsemi Semiconductor Limited
- Current Assignee Address: GB Caldicot, Monmouthsh
- Agent Simon Kahn
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L25/065 ; H01L25/00 ; H01L21/56 ; H01L25/10 ; H01L23/00 ; H01L23/31 ; H05K1/18

Abstract:
An embedded integrated circuit package is made by providing a substrate with a patterned conductor layer defining bond pads. One or more components typically with upwardly facing contact pads are mounted on the substrate. The contact pads are wire bonded to the bond pads of the patterned conductor layer. A series of layers, each with one or more cut-outs corresponding to locations of the components forms a first solid stack containing cavities accommodating the components and associated wires. In one embodiment the layers are fiberglass layers and the layers are cured in the presence of a resin to form a solid body. In another embodiment the layers are thermoplastic layers.
Public/Granted literature
- US20160260685A1 Embedded Circuit Package Public/Granted day:2016-09-08
Information query
IPC分类: