Invention Grant
- Patent Title: Power module with a plurality of patterns with convex and concave side
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Application No.: US14863837Application Date: 2015-09-24
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Publication No.: US09698125B2Publication Date: 2017-07-04
- Inventor: Yukihiro Sato , Katsuhiko Funatsu , Takamitsu Kanazawa , Masahiro Koido , Hiroyoshi Taya
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2014-199925 20140930
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44 ; H01L25/065 ; H01L23/498 ; H01L25/07 ; H01L23/00 ; H01L23/049 ; H01L21/48 ; H01L23/373 ; H01L25/16 ; H01L25/18 ; H02M7/219 ; H01L23/24
Abstract:
Reduction in reliability of a semiconductor device is suppressed. A semiconductor device includes a plurality of metal patterns formed on a ceramic substrate, and a plurality of semiconductor chips mounted on the plurality of metal patterns. Also, the plurality of metal patterns include metal patterns MPH and MPU which face each other. In addition, a region which is provided between these metal patterns MPH and MPU and which is exposed from the plurality of metal patterns extends so as to zigzag along an extending direction of the metal pattern MPH.
Public/Granted literature
- US20160093589A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-03-31
Information query
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