A method of manufacturing a multichip package structure includes providing a substrate body; placing a plurality of light-emitting chips on the substrate body, the light-emitting chips being electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame having a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, the semidrying surrounding light-reflecting frame contacting and surrounding the package colloid body.