Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15062208Application Date: 2016-03-07
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Publication No.: US09698141B2Publication Date: 2017-07-04
- Inventor: Yasunobu Saito , Toshiyuki Naka , Akira Yoshioka
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2015-175058 20150904
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/20 ; H01L29/205 ; H01L29/207 ; H01L29/778 ; H01L29/866 ; H01L29/06 ; H01L29/66

Abstract:
A semiconductor device includes a first nitride semiconductor layer having a first region, a second nitride semiconductor layer that is on the first nitride semiconductor layer and contains carbon and silicon, a third nitride semiconductor layer that is on the second nitride semiconductor layer and has a second region, a fourth nitride semiconductor layer on the third nitride semiconductor layer, the fourth nitride semiconductor layer having a band gap that is wider than a band gap of the third nitride semiconductor layer, a source electrode that is on the fourth nitride semiconductor layer and is electrically connected to the first region, a drain electrode that is on the fourth nitride semiconductor layer and is electrically connected to the second region, and a gate electrode that is on the fourth nitride semiconductor layer and is between the source electrode and the drain electrode.
Public/Granted literature
- US20170069623A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-03-09
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