Invention Grant
- Patent Title: Semiconductor integrated circuit device having low and high withstanding-voltage MOS transistors
-
Application No.: US15050807Application Date: 2016-02-23
-
Publication No.: US09698147B2Publication Date: 2017-07-04
- Inventor: Hirofumi Harada , Keisuke Uemura , Hisashi Hasegawa , Shinjiro Kato , Hideo Yoshino
- Applicant: SII Semiconductor Corporation
- Applicant Address: JP
- Assignee: SII Semiconductor Corporation
- Current Assignee: SII Semiconductor Corporation
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2015-035501 20150225; JP2015-037330 20150226; JP2015-194572 20150930
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/08 ; H01L29/66 ; H01L29/78 ; H01L27/092 ; H01L21/02 ; H01L21/8238 ; H01L29/06

Abstract:
A semiconductor integrated circuit device has a first N-channel type high withstanding-voltage MOS transistor and a second N-channel type high withstanding-voltage MOS transistor formed on an N-type semiconductor substrate. The first N-channel type high withstanding-voltage transistor includes a third N-type low-concentration impurity region containing arsenic having a depth smaller than a P-type well region in a drain region within the P-type well region, and the second N-channel type high withstanding-voltage MOS transistor includes a fourth N-type low-concentration impurity region that is adjacent to the P-type well region and has a bottom surface in contact with the N-type semiconductor substrate. In this manner, the high withstanding-voltage NMOS transistors are capable of operating at 30 V or higher and are integrated on the N-type semiconductor substrate.
Public/Granted literature
- US20160247804A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-08-25
Information query
IPC分类: