Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
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Application No.: US14847699Application Date: 2015-09-08
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Publication No.: US09698199B2Publication Date: 2017-07-04
- Inventor: Takashi Yokoyama
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2013-098525 20130508
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L45/00 ; H01L27/24 ; H01L27/12 ; H01L21/8234 ; H01L21/84

Abstract:
A semiconductor device including a transistor on a main surface side of a semiconductor substrate; and a resistance change element on a back-surface side of the semiconductor substrate, wherein the transistor includes a low-resistance section in the semiconductor substrate, the low-resistance section extending to the back surface of the semiconductor substrate, an insulating film is provided in contact with a back surface of the low-resistance section, the insulating film has an opening facing the low-resistance section, and the resistance change element is connected to the low-resistance section through the opening.
Public/Granted literature
- US20150380463A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2015-12-31
Information query
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