Invention Grant
- Patent Title: Semiconductor unit, method of manufacturing the same, and electronic apparatus
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Application No.: US14939277Application Date: 2015-11-12
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Publication No.: US09698209B2Publication Date: 2017-07-04
- Inventor: Hironobu Abe
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2012-023315 20120206
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L29/205 ; H01L27/32 ; H01L33/62 ; H01L23/48 ; G02F1/1345 ; H05K3/36 ; H05K1/02 ; H01L51/00 ; H01L27/12 ; H05K3/32
Abstract:
There are provided a semiconductor unit that prevents connection failure caused by a wiring substrate to improve reliability, a method of manufacturing the semiconductor unit, and an electronic apparatus including the semiconductor unit. The semiconductor unit includes: a device substrate including a functional device and an electrode; a first wiring substrate electrically connected to the functional device through the electrode; and a second wiring substrate electrically connected to the functional device through the first wiring substrate.
Public/Granted literature
- US20160064468A1 SEMICONDUCTOR UNIT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2016-03-03
Information query
IPC分类:
