Invention Grant
- Patent Title: Method for forming semiconductor structure
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Application No.: US15221617Application Date: 2016-07-28
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Publication No.: US09698218B2Publication Date: 2017-07-04
- Inventor: Hsin-Yu Chen , Sheng-Hao Lin , Huai-Tzu Chiang , Hao-Ming Lee
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; B82Y30/00 ; B82Y40/00 ; H01L21/324 ; H01L21/306 ; H01L29/10

Abstract:
The present invention provides some methods for forming at least two different nanowire structures with different diameters on one substrate. Since the diameter of the nanowire structure will influence the threshold voltage (Vt) and the drive currents of a nanowire field effect transistor, in this invention, at least two nanowire structures with different diameters can be formed on one substrate. Therefore, in the following steps, these nanowire structures can be applied in different nanowire field effect transistors with different Vt and drive currents. This way, the flexibility of the nanowire field effect transistors can be improved.
Public/Granted literature
- US20160336401A1 METHOD FOR FORMING SEMICONDUCTOR STRUCTURE Public/Granted day:2016-11-17
Information query
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