Invention Grant
- Patent Title: Integrated circuit combination of a target integrated circuit and a plurality of thin film photovoltaic cells connected thereto using a conductive path
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Application No.: US14580692Application Date: 2014-12-23
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Publication No.: US09698299B2Publication Date: 2017-07-04
- Inventor: Shani Keysar , Reuven Holzer , Ofer Navon , Ram Friedlander
- Applicant: Sol Chip Ltd.
- Applicant Address: IL Haifa
- Assignee: Sol Chip Ltd.
- Current Assignee: Sol Chip Ltd.
- Current Assignee Address: IL Haifa
- Agency: M&B IP Analysts, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/18 ; H01L25/16 ; H01L27/118 ; H01L27/142 ; H01L31/0392 ; H01L31/046 ; H01L25/00 ; H01L31/0465 ; H01L23/00

Abstract:
A device having a plurality of thin film photovoltaic cells (PV) formed over a passivation layer. The device comprises a plurality of thin film photovoltaic (PV) cells formed over the passivation layer, each PV cell includes at least a lower conducting layer (LCL) and an upper conducting layer (UCL); and a conducting path connecting at least a UCL of a first PV cell to at least a LCL of a second PV cell, wherein at least a first array of PV cells comprised of at least a first portion of the plurality of PV cells is connected by the respective UCL and LCL of each PV cell to provide a first voltage output. In an embodiment the passivation layer is formed over a target integrated circuit (TIC), the TIC having a top surface and a bottom surface.
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