Invention Grant
- Patent Title: Package thin film and manufacturing method thereof, light emitting device, display panel and display device
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Application No.: US15038524Application Date: 2015-10-08
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Publication No.: US09698360B2Publication Date: 2017-07-04
- Inventor: Shoulei Shi , Hsiaowen Hung
- Applicant: Boe Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Boe Technology Group Co., Ltd.
- Current Assignee: Boe Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Calfee, Halter & Griswold LLP
- Priority: CN201510280981 20150528
- International Application: PCT/CN2015/091430 WO 20151008
- International Announcement: WO2016/188006 WO 20161201
- Main IPC: H01L51/50
- IPC: H01L51/50 ; H01L51/00 ; H01L51/56 ; H01L51/52
Abstract:
A package thin film and a manufacturing method thereof, a light emitting device, a display panel and a display device are provided. The package thin film may comprise: a nano material layer or a polycation organic material layer, a moisture absorption layer formed on the nano material layer or the polycation organic material layer, a sealing layer for sealing the nano material layer or the polycation organic material layer and the moisture absorption layer. The package structure provided by embodiments of the present invention is formed by alternate assembly of materials (the nano material layer or the polycation organic material layer and the moisture absorption layer) with different charges.
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