Invention Grant
- Patent Title: Encapsulation film
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Application No.: US14323703Application Date: 2014-07-03
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Publication No.: US09698378B2Publication Date: 2017-07-04
- Inventor: Yoon Gyung Cho , Hyun Jee Yoo , Suk Ky Chang , Jung Sup Shim , Seung Min Lee
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2012-0002170 20120106; KR10-2013-0001826 20130107
- Main IPC: B32B27/08
- IPC: B32B27/08 ; H01L51/52 ; H01L51/56 ; B32B27/18 ; H01L23/29 ; H01L21/56 ; H05B33/04 ; B32B43/00 ; B32B37/14 ; C09D123/22 ; C09D163/00 ; B32B3/04 ; B32B37/10 ; B32B37/12 ; B32B37/24
Abstract:
Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.
Public/Granted literature
- US20140319999A1 ENCAPSULATION FILM Public/Granted day:2014-10-30
Information query
