A metal computing device case includes one or more metal side faces bounding at least a portion of the metal back face. The metal computing device case includes a radiating structure including an exterior metal surface of the metal computing device case. The metal computing device case substantially encloses electronics of a computing device. The exterior metal surface is a metal plate insulated from the rest of the metal computing device case by a dielectric insert filling slots between the metal plate and the rest of the metal computing device case. The radiating structure also includes a ceramic block spaced from a metal plate by a dielectric spacer. The metal plate is insulated from the rest of the metal computing device case and is capacitively coupled with the ceramic block.