A wire clamp connector includes a connecting board, a plurality of conductive sheets, a plurality of conductive mounts, and a plurality of wire clamp components. The conductive sheets are disposed at one surface of the connecting board. The conductive mounts are disposed at the top of the connecting board and connected to the conductive sheets. The wire clamp components are disposed at the respective conductive mounts. Each of the wire clamp components includes a lock member and a clamping piece. The lock member pushes the clamping piece to push against a wire, so that the wire can be firmly positioned with the corresponding conductive mount. Furthermore, the wire clamp connector may be applied to the wall mount component so as to be mounted on a wall and connected to an electronic product.