Invention Grant
- Patent Title: On-die termination/driving circuit and method of using the same
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Application No.: US14711855Application Date: 2015-05-14
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Publication No.: US09698778B2Publication Date: 2017-07-04
- Inventor: Tien-Chien Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H03K19/00
- IPC: H03K19/00 ; H03K19/0175 ; H03K19/003

Abstract:
An on-die termination (ODT)/driving circuit includes a connection pad, and a sub-circuit. A first side of the sub-circuit is connected to the connection pad. The ODT/driving circuit further includes a first switch directly connected to a second side of the sub-circuit. The second side of the sub-circuit is opposite the first side of the sub-circuit. The first switch is configured to selectively connect the second side of the sub-circuit to a supply voltage. The ODT/driving circuit further includes a second switch directly connected to the second side of the sub-circuit. The second switch is configured to selectively connect the second side of the sub-circuit to a reference voltage. The ODT/driving circuit further includes a receiver connected to a node located between the connection pad and the first side of the sub-circuit.
Public/Granted literature
- US20160094222A1 ON-DIE TERMINATION/DRIVING CIRCUIT AND METHOD OF USING THE SAME Public/Granted day:2016-03-31
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