Invention Grant
- Patent Title: Driver integrated circuit
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Application No.: US14122623Application Date: 2012-05-24
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Publication No.: US09698783B2Publication Date: 2017-07-04
- Inventor: Wen Li , Norio Chujo , Masami Makuuchi , Takehito Kamimura
- Applicant: Wen Li , Norio Chujo , Masami Makuuchi , Takehito Kamimura
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2011-119185 20110527
- International Application: PCT/JP2012/063297 WO 20120524
- International Announcement: WO2012/165285 WO 20121206
- Main IPC: H03K19/0175
- IPC: H03K19/0175 ; H03F1/52 ; H03F3/195 ; H03F3/21 ; H03F3/30

Abstract:
Provided is a configuration of a driver integrated circuit that can output a voltage exceeding the withstand voltage of a process, and that satisfies required apparatus performance (high speed and high voltage). A differential input circuit, a level shift circuit, and an output circuit are manufactured by the same process and divided and disposed on three or more chips with different substrate potentials (sub-potentials). By setting different applied voltages to the substrates of the chips, an output voltage greater than the process withstand voltage can be provided (see FIG. 2).
Public/Granted literature
- US20140125398A1 Driver Integrated Circuit Public/Granted day:2014-05-08
Information query
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