Invention Grant
- Patent Title: Integrated circuit
-
Application No.: US14715563Application Date: 2015-05-18
-
Publication No.: US09698789B2Publication Date: 2017-07-04
- Inventor: Chiao-Wei Hsiao , Shyr-Chyau Luo
- Applicant: Novatek Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: Novatek Microelectronics Corp.
- Current Assignee: Novatek Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW104104720A 20150212
- Main IPC: H03H11/28
- IPC: H03H11/28 ; H03K19/0185 ; H02H9/04

Abstract:
An integrated circuit is provided. The integrated circuit includes a pad, a core circuit, an impedance matching component, a first switch and a second switch. The pad is configured to transmit a communication signal. A communication terminal of the core circuit is coupled to the pad, and a power terminal of the core circuit is coupled to a system voltage rail. A first terminal of the impedance matching component is coupled to the pad. A first terminal of the first switch is coupled to the system voltage rail, and a second terminal of the first switch is coupled to a second terminal of the impedance matching component. A first terminal of the second switch is coupled to a control terminal of the first switch, and a second terminal of the second switch is coupled to the second terminal of the impedance matching component.
Public/Granted literature
- US20160072478A1 INTEGRATED CIRCUIT Public/Granted day:2016-03-10
Information query