Invention Grant
- Patent Title: Electric element-embedded multilayer substrate and method for manufacturing the same
-
Application No.: US14021103Application Date: 2013-09-09
-
Publication No.: US09699892B2Publication Date: 2017-07-04
- Inventor: Noboru Kato , Masahiro Ozawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-053028 20110310
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H01L23/538 ; H05K3/46 ; H01L23/498

Abstract:
An electric element-embedded multilayer substrate, which is a multilayer substrate including an electric element embedded therein and a plurality of base material layers having flexibility, the electric element including a main surface and being embedded in the multilayer substrate to be sandwiched between the base material layers, and a slide member provided between the main surface of the electric element and the base material layer.
Public/Granted literature
- US20140003011A1 ELECTRIC ELEMENT-EMBEDDED MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-01-02
Information query