Invention Grant
- Patent Title: Deformation sensing flexible substrate using pattern formed of conductive material
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Application No.: US14895944Application Date: 2015-03-11
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Publication No.: US09699894B2Publication Date: 2017-07-04
- Inventor: Maenghyo Cho , Kyu Jin Cho , Junghyun Ryu , Je Sung Koh , Jong Gu Lee
- Applicant: Seoul National University R&DB Foundation
- Applicant Address: KR Seoul
- Assignee: Seoul National University R&DB Foundation
- Current Assignee: Seoul National University R&DB Foundation
- Current Assignee Address: KR Seoul
- Agency: Osha Liang LLP
- International Application: PCT/KR2015/002376 WO 20150311
- International Announcement: WO2016/143925 WO 20160915
- Main IPC: G01R27/08
- IPC: G01R27/08 ; H05K1/02 ; H05K3/12 ; G01B7/16 ; G01R27/02 ; G01N27/00 ; G01R27/00 ; G01N27/02
Abstract:
Disclosed herein is a deformation sensing flexible substrate using a pattern formed of a conductive material. The deformation sensing flexible substrate, using the pattern formed of the conductive material, includes a flexible substrate; and conductive patterns in which conductors including a conductive material are arranged and formed to be contactable and non-contact to each other based on deformation of the flexible substrate.
Public/Granted literature
- US20170048965A1 DEFORMATION SENSING FLEXIBLE SUBSTRATE USING PATTERN FORMED OF CONDUCTIVE MATERIAL Public/Granted day:2017-02-16
Information query
