In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure.