There is provided a component mounting method for fitting a component including downwardly-extending insertion pins on a substrate by sucking the component by a suction nozzle and moving the suction nozzle such that the insertion pins of the sucked component are inserted into pin insertion holes formed in a substrate. The component mounting method includes: positioning the insertion pins and the pin insertion holes, and then pushing the component against the substrate by the suction nozzle, thereby fitting the component on the substrate such that the insertion pins are inserted into the pin insertion holes; and pushing again the component against the substrate after the component is fitted on the substrate, so as to push the insertion pins into the pin insertion holes.