Invention Grant
- Patent Title: Dip molding process for the manufacture of hard capsule shells
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Application No.: US15357693Application Date: 2016-11-21
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Publication No.: US09700518B1Publication Date: 2017-07-11
- Inventor: Karl Wei Cao
- Applicant: Karl Wei Cao
- Agency: Buskop Law Group P.C.
- Agent Wendy Buskop
- Main IPC: A61K9/48
- IPC: A61K9/48 ; B29C41/14 ; B29C41/46 ; B29C37/00 ; A61K9/28 ; B29K105/00 ; B29L31/00

Abstract:
A dip molding process for the manufacture of allergen free hard capsule shells includes forming an allergen free solution, increasing the temperature of the allergen free solution, filtering the heated allergen free solution, vacuuming the filtrate to remove from 98 percent to 99 percent of air bubbles forming a reduced bubble filtrate, cooling the reduced bubble filtrate, dipping molding pins into the cooled filtrate, withdrawing the molding pins from the cooled filtrate, drying the molding pins with the cooled filtrate to form hard capsule shells, and coating the hard capsule shells with a vegetarian polishing agent. The formed vegan and allergen free hard capsules are dimensionally stable with a combination of (i) mechanical strength, (ii) resistance to cracking and (iii) resiliency. The created vegan and allergen free hard capsules have a body and cap that easily engage while producing an oxygen barrier for product.
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