An apparatus and method for distressing material, such as a board. The apparatus may include a cutter head supporting a blade, a guide member, and a flattening device. The flattening device and the guide member are positioned proximate the cutter head and on opposite sides thereof. In response to the cutter head and the surface of the material being brought into cutting contact and moved relative to each other, a resulting portion of the surface of the material is distressed. The flattening device maintains the proper vertical position of the cutter head and blade relative to the material and a material support as the material is being brought into cutting contact with the cutter head. The guide member levels warped material boards thereby bringing the board into proper elevation and engagement with the blade for cutting or scraping a top surface of the board. The material may be wood.