The present invention relates to a thermoplastic molding composition comprising a) 77.7% to 99.7% by weight of one or more styrene copolymers, as component A b) 0.1% to 5% by weight of the compounds of the formulae I, II, III, IV, and V, or isomers thereof, as component B: c) 0.2% to 0.7% by weight of a compound of the formula (VI), as component C: d) 0.2% to 0.7% by weight of a mixture of the formula (VII), as component D: e) 0% to 0.5% by weight of a compound of the formula (VIII) as component E:  or 0% to 0.5% by weight of a compound of the formula (X):  or 0% to 0.5% by weight of a compound of the formula (XI): f) 0% to 10% by weight of one or more additives which are different from components B, C, D, and E, as component F, and the percentage by weight being based in each case on the total weight of components A to F and together making up 100% by weight.